发明名称 Thermoplastic molding material for electronic packaging
摘要 A thermoplastic composition comprising a polyethylene terephthalate having chemically incorporated within the polyethylene terephthalate a) crystallinity reducing amount of an isophathalic acid, or a crystallinity reducing amount of diethylene glycol, or a crystallinity reducing amount of a combination of an isophathalic acid and diethylene glycol thereby making a modified polyethylene terephthalate; b) a chain extending agent which has reacted with a carboxy end group or an alcohol end group, and c) an amount of at least one antiblocking agent that maintains the neck opening of a parison formed from the composition, the parison surrounding a capacitor.
申请公布号 US2006275569(A1) 申请公布日期 2006.12.07
申请号 US20050284352 申请日期 2005.11.21
申请人 MISHRA SANJAY B;AN YUXIAN;GU FANGMING;SHE YONG 发明人 MISHRA SANJAY B.;AN YUXIAN;GU FANGMING (.;SHE YONG
分类号 B32B27/08 主分类号 B32B27/08
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