发明名称 NON-CONTACT IC TAG HAVING IC CHIP BREAKDOWN PREVENTION STRUCTURE, AND MANUFACTURING METHOD OF NON-CONTACT IC TAG
摘要 <P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag and a manufacturing method thereof for preventing an IC chip from being broken by external force applied. <P>SOLUTION: A non-contact IC tag 1 having an IC chip breakdown prevention structure forms an antenna pattern 2 on a base film surface 11, mounts an IC chip 3 thereon, and has a surface protective member to cover them. Two sheets of strip-like structures 10a, 10b are arranged at intervals, so as to form parallel band-shaped groove 9, on both sides of the IC chip 3, and the IC chip 3 is positioned in the band-shaped groove 9. It is desirable for the structures 10a, 10b to be paper, plastic films, or magnetic material sheets each having uniform thickness of 50 to 250 &mu;m. The structures 10a, 10b can be adhered by using an IC tag processing machine or a label sticking machine. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006330967(A) 申请公布日期 2006.12.07
申请号 JP20050151967 申请日期 2005.05.25
申请人 DAINIPPON PRINTING CO LTD 发明人 OGATA TETSUJI
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
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