摘要 |
PROBLEM TO BE SOLVED: To provide a robot device which allows the tact time to be shortened. SOLUTION: This robot device for transferring a semiconductor wafer U is provided with an attachment body 13, an arm body 31 provided rotatably on the attachment body, a driving source 15 for rotatably driving the arm body, a stationary pulley 38 provided on the attachment body and located at the rotation center of the arm body, and a pair of rotational pulleys 41, 42 provided rotatably at both ends of the arm body. Furthermore, the device is provided with a pair of fingers 47, 48 of which each an end portion is attached to respective rotating pulleys, and which rotate with the rotating pulleys to transport a work, and a timing belt 43 for making the rotating pulleys rotate, according to the outside diameter ratio of the stationary pulley to the rotational pulleys, when the arm body is rotated by the driving source, provided over the stationary pulley and the rotating pulleys. COPYRIGHT: (C)2007,JPO&INPIT
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