发明名称 LEAD FRAME, MANUFACTURING METHOD OF SOLID ELECTROLYTIC CAPACITOR OF LOWER-SIDE ELECTRODE TYPE EMPLOYING THE SAME, AND SOLID ELECTROLYTIC CAPACITOR OF LOWER-SIDE ELECTRODE TYPE MANUFACTURED BY THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor of lower-side electrode type manufactured by using a lead frame of a structure, wherein the current path distance between the anode and the cathode is short, the skin effect at a high-frequency band is high, and the ESL and ESR of the whole capacitor can be fully lowered. SOLUTION: The capacitor employs the lead frame of the structure, wherein the connection range for connecting a cathode terminal and a capacitive element 11 by a conductive adhesive extends from a cathode side toward a part close to a reference face side. The reference face is a connection end face at an anode lead wire embedded face of the capacitive element 11 in a cathode terminal forming part 22 provided facing an anode terminal forming part 21, so that the cathode terminal extends up to the anode terminal side and is exposed on the mounting side. After the capacitive element 11 connected to the lead frame has been molded by an outer packaging resin 19, the molded capacitive element 11 is cut along an anode side cut face 23a and a cathode side cut face 23b, and a chip body separated from the lead frame is obtained. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006332403(A) 申请公布日期 2006.12.07
申请号 JP20050154998 申请日期 2005.05.27
申请人 NEC TOKIN CORP;NEC TOKIN TOYAMA LTD 发明人 ISHIJIMA MASAYA
分类号 H01G9/15;H01G9/00;H01G9/14 主分类号 H01G9/15
代理机构 代理人
主权项
地址