| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for suppressing variation in position between chips or inclination thereof in a metal package when a plurality of chips are bonded to a metal package in a semiconductor device. SOLUTION: A plurality of chips 2 are classified into desired groups 2-1 and 2-2. Two reference points of positioning are set on a metal package 1 for each group, relative position between chips in the group and inclination of each chip at a predetermined heating temperature are corrected with reference to a line connecting two reference points of positioning and then the chips are soldered to the metal package 1. COPYRIGHT: (C)2007,JPO&INPIT
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