发明名称 PICKUP DEVICE AND PICKUP METHOD FOR CHIP
摘要 PROBLEM TO BE SOLVED: To provide a lower side receiving unit for retaining a sheet while being abutted against the lower surface side of the sheet, with the optimum size in accordance with a chip. SOLUTION: When the chip is photographed by a component observation camera 17 as the object of an area wherein the receiving unit 8a will not interfere with an expand ring 9, in the pickup of the chip for picking up the chip 6 bonded to the sheet 5, an abutted photographing mode is applied for photographing the chip 6 under a state that the abutting surface 8c of the receiving unit 8a is abutted against the lower surface of the sheet 5. When the area is selected as the object wherein the receiving unit 8a interferes with the expand ring 9, an evacuation photographing mode is applied for wherein photographing the chip 6 under evacuated condition wherein the receiving unit 8a is separated from the lower surface of a sheet 5, to a position whereat the receiving unit 8a will not interfere with the expand ring 9. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006332309(A) 申请公布日期 2006.12.07
申请号 JP20050153505 申请日期 2005.05.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIRAKI TSUTOMU;YASUMOTO TAKASHI
分类号 H01L21/68;H01L21/52;H01L21/67 主分类号 H01L21/68
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