发明名称 FLAME-RETARDANT ADHESIVE COMPOSITION, AND ADHESIVE SHEET, COVER LAY FILM AND FLEXIBLE COPPER-CLAD LAMINATE OBTAINED USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a non-halogen adhesive composition whose cured product exhibits excellent flame retardancy and migration resistance, and an adhesive sheet, a cover lay film and a flexible copper-clad laminate obtained using the composition. SOLUTION: The flame-retardant adhesive composition comprises (A) a non-halogen epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate salt compound, (E) a curing accelerator and (F) a nitrogen-containing organic phosphoric acid compound represented by general formula (1) (wherein R<SP>1</SP>-R<SP>4</SP>are each a hydrogen atom or an alkyl group; and X is a nitrogen-containing bivalent organic group). The adhesive sheet has a layer composed of the composition and a protective layer covering the layer composed of the composition. The cover lay film comprises an electrically insulating film and a layer composed of the composition formed on the film. The flexible copper-clad laminate comprises an electrically insulating film, a layer composed of the composition formed on the film, and a copper foil. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006328113(A) 申请公布日期 2006.12.07
申请号 JP20050149920 申请日期 2005.05.23
申请人 SHIN ETSU CHEM CO LTD 发明人 NAKANISHI NOBORU;KONDO KAZUNORI;HOSHIDA SHIGEHIRO;AMANO TADASHI
分类号 C09J163/00;B32B15/092;C09J7/02;C09J11/00;C09J121/00 主分类号 C09J163/00
代理机构 代理人
主权项
地址