发明名称 Source contact and metal scheme for high density trench MOSFET
摘要 A trenched metal oxide semiconductor field effect transistor (MOSFET) cell that includes a trenched gate surrounded by a source region encompassed in a body region above a drain region disposed on a bottom surface of a substrate. The MOSFET cell further includes a source-body contact trench opened with sidewalls substantially perpendicular to a top surface into the source and body regions and filled with contact metal plug.
申请公布号 US2006273380(A1) 申请公布日期 2006.12.07
申请号 US20050147075 申请日期 2005.06.06
申请人 M-MOS SDN.BHD. 发明人 HSHIEH FWU-IUAN
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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