DEVICE AND METHOD FOR LAPPING WITH A CUTTING WIRE

摘要

The invention relates to a device for lapping or grinding with a cutting wire or with a cutting strip, or similar, comprising an oscillating device for a workpiece (8), by means of which the workpiece is positioned such as to be able to oscillate relative to an oscillation axis about a given angle along a wire (section) (11) or strip (section), a feed unit for the workpiece (8) and means for carrying out the cutting movement with or in connection with a wire (section) (11) or strip (section),characterized in that the feed unit (4) for the workpiece (8) is arranged after the oscillation axis (5) located in a fixed position relative to the wire section (11) or strip (section), such that the feed unit (4) carries out the oscillation movement relative to the wire (section) (11) or strip (field) together with the workpiece (8). A method is also disclosed.