| 摘要 |
<p>A wafer (100) with a fixing agent, having a supporting wafer (1) and the fixing agent (2) arranged on the surface of the supporting wafer (1). The wafer (100) further has an infiltration preventive structure (3) arranged at an edge section of the supporting wafer (1). The fixing agent (2) is arranged in a recess formed by the supporting wafer (1) and the infiltration preventive structure (3). When the supporting wafer (1) and a wafer to be processed are bonded and fixed, the fixing agent (2) is prevented from projecting and contaminating the work environment, and further, a liquid substance can be prevented from infiltrating between the supporting wafer (1) and the wafer to be processed.</p> |
