| 摘要 |
A plasma cleaning apparatus is provided to reinforce a twist phenomenon of cleaning gas by installing at least three cleaning gas nozzles in a chamber and by upwardly injecting cleaning gas clockwise or counterclockwise. A space is prepared in a chamber(100) including an upper part(120) and a body(130). The outer surface of the upper part of the chamber is surrounded by Coils(140) to which RF power is applied. A chuck assembly(160) is located in the center of the inside of the chamber, including an electrostatic chuck(150) for fixing a wafer. At least three cleaning gas nozzles(180) inject cleaning gas, located in the body of the chamber. The cleaning gas nozzles are formed in a manner that the cleaning gas is injected toward the upper part of the inside of the chamber.
|
