| 摘要 |
An apparatus for labeling a wafer is provided to adjust an optimum focus of a laser beam irradiated to a wafer by measuring the focus of a laser beam while using a laser detecting unit before a label is indicated on the wafer and by vertically transferring a focus mirror by a label control part so that a label process is performed on the wafer while the focus of the laser beam is adjusted. A wafer align unit(121) aligns a wafer to precisely display a label in a label region of the wafer, installed over a main body(111). A laser generating unit(131) irradiates a laser beam to the wafer to display a label on the wafer, formed over the wafer align unit. A focus mirror(141) adjusts the focus of the laser beam, installed between the laser generating unit and the wafer align unit. A laser detecting unit(151) detects the focus state and light intensity of the laser beam, installed in the wafer align unit. A label control part(161) receives an output signal of the laser detecting unit to drive the focus mirror so that the focus of the laser beam is optimized, and controls the operation of the laser generating unit to maintain the light intensity of the laser beam uniformly. The laser generating unit includes a laser diode for converting current into laser.
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