PROCESS FOR PRODUCING ELECTRONIC SUBSTRATE, PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To achieve thinning and high density without causing cost increase and deterioration in productivity.

SOLUTION: Electronic components 40-42 are mounted on a substrate 5. A process for burying the electronic components 40-42 in the substrate 5, and a process for forming a wiring pattern 23 connected with external connection electrodes 40a-42a of the electronic components 40-42 buried in the substrate 5 by ejecting a liquid drop containing a conductive material are provided.

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