| 摘要 |
PROBLEM TO BE SOLVED: To reduce height of a semiconductor device with a structure wherein two semiconductor elements are stacked. SOLUTION: In the semiconductor device with a structure wherein a first semiconductor element 22 and a second semiconductor element 23 are stacked on a substrate 24, the first semiconductor element 22 is fixed on the substrate 24 by face-up, and a connection terminal 22A provided to the first semiconductor element 22 and the substrate 24 are connected by means of a wire 28. It is furthermore constituted so that terminal characteristic of the connection terminal 23A provided to the second semiconductor element 23 shows characteristic of mirror inversion to terminal characteristic of the connection terminal 22A of the first semiconductor element 22, and the connection terminal 23A is subjected to flip chip junction on the connection terminal 22A which is subjected to wire connection. COPYRIGHT: (C)2007,JPO&INPIT
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