| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism for holding a crystal wafer that requires the parallelism of the principal surface of the wafer which is contrary to high flatness. SOLUTION: This crystal wafer hold mechanism 3 is used when a crystal wafer 1 is dipped in etchant for wet etching. This mechanism comprises a revolution plate 6 which rotates using a revolution shaft 4 as a center of axle, a crystal wafer storage 9 which rotates using a rotational shaft 7 provided on the revolution plate 6 as a center of axle, a crystal wafer holder 10 which retains the crystal wafer 1 in the crystal wafer storage, and a gear 11 for rotating the revolution shaft 6 and rotational shaft 7. The rotational shaft 7 rotates reversely for the rotation of the revolution shaft 6, and the ratio of revolution (of the revolution shaft 6) to rotation (of the rotational shaft 7) is 1:-1.1 to 0.9 (a minus sign for rotation indicates that the direction of rotation is reverse to that of revolution). COPYRIGHT: (C)2007,JPO&INPIT |
