| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method which can prevent failure or a reduction of yield in manufacturing process while suppressing the enlargement of the semiconductor device. SOLUTION: The device comprises a supporting semiconductor substrate 11; a lower electrode 13 formed on the supporting substrate 11; an interlayer insulating film 12, which is formed on the lower electrode 13, having an aperture 12a arranged in such a manner that a groove of designated width is combined in plurality, so that they may cross each other; an insulating film 15 formed in a side wall and bottom of the aperture 12a; an electrode 14 in the aperture formed on the insulating film 15 inside the aperture 12a; and an upper electrode 16 formed on the insulating film 15 and on the electrode 14 in the aperture. COPYRIGHT: (C)2007,JPO&INPIT |
