| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy for low temperature joining of glass or ceramics which does not include Pb harmful for the human body and further has high joining strength. SOLUTION: The leadless solder alloy for low temperature joining of glass or ceramics is obtained by adding, by weight, 0.001 to 3% gallium to a low melting point leadless solder alloy which essentially consists of tin and/or bismuth, does not include lead, and has a melting point in the range of 120 to 200°C. The amount of the gallium to be added preferably lies in the range of 0.01 to 2% in particular. Even in the case the amount of the gallium to be added is 0.001%, the addition effect is recognized, and the joining strength reaches 7 kg/mm<SP>2</SP>, but, in 0.01%, it reaches the 10 kg/mm<SP>2</SP>level. Even if the amount of the gallium to be added is controlled to≥2%, the further improvement of the joining strength is not recognized. COPYRIGHT: (C)2007,JPO&INPIT
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