MONOLITHIC MULTI-LEVEL MODULE AND METHOD

摘要

An interposer (1) having a substrate (10) composed of a flat flexible thin sheet of plastic dielectric material having a copper film laminated on one side. The substrate defines a component site in the form of a cavity (20) in the substrate. The copper film defines a plurality of separated interconnects, each having a tab (22) extending into the cavity (20) formed in the substrate. An electrical component (18) having contacts is positioned in the cavity and its contacts are bonded to the tabs. At least a plurality of the separate interconnects extend laterally beyond the substrate to define flanges (14). The substrate is profiled to be easily oriented in a PCB (30). A monolithic multi-level micropackage (110) having a plurality of layers of copper foils (112) laminated on flexible thin substrates (116) processed to embed in at least one layer of an interposer according to the above, the layers being bonded together by a bonding material and compressed to form a monolithic structure. Monolithic structure can have geometry to enable registration in a PCB. The geometry can be cylindrical with protrusions. The top layer (103) can define connecting flanges to connect with leads on the PCB. Heat sinks (60) can be incorporated into the structure.