| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, for which silicon is used as the base material of the wiring board, and also to provide a method of manufacturing the same, and a semiconductor device that uses the same. SOLUTION: The wiring board, on which electronic components are mounted and which is mounted on the mother board 139, constitutes a wiring substrate for a multi-chip semiconductor device, and is a silicon board 106 composed of silicon. A first electrically conductive pattern 112, composed of at least one layer for mounting and wiring the electronic components, is provided on the surface of the silicon board, and a second electrically conductive pattern 113 composed of at least one layer and having electrodes for mounting the board on the mother board, is provided on the rear surface of the silicon board. The first electrically conductive pattern and the second electrically conductive pattern are electrically connected by a third electrically conductive pattern 114, formed on the side surfaces of the silicon board. COPYRIGHT: (C)2007,JPO&INPIT
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