| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition featured by good flowability, good mold release, and good continuous moldability upon molding and high soldering heat resistance. SOLUTION: The semiconductor-sealing epoxy resin composition essentially consists of (A) an epoxy resin, (B) a phenolic resin hardener, (C) a cure accelerator, and (D) an inorganic filler, as main components, wherein at least either of the (A) epoxy resin or the (B) phenolic resin hardener contains a biphenylene-skeleton-containing novolak structure resin in the main chain, (E) a glycerol trifatty acid ester is also contained in an amount of 0.01 wt.% or more and 1 wt.% or less based on the total epoxy resin composition, and (F) a silane coupling agent with a defined structure is further contained in an amount of 0.05 wt.% or more and 0.5 wt.% or less based on the total epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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