| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide polishing equipment capable of polishing a wafer at a high profile accuracy which has a large diameter processing surface. <P>SOLUTION: The present polishing equipment of semiconductor wafer forms a processing chamber which is arranged extendedly in an aperture of head body and in partition from exterior between it and the head body, comprises a roughly circular membrane holding the semiconductor wafer with an inner circumference lower surface, and prepares an air temperature controlling means for controlling a temperature of air directly pressurizing the membrane with air pressure. <P>COPYRIGHT: (C)2007,JPO&INPIT |
