| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of improving its durability by preventing the separation of conductive particles contained in a semiconductor layer while effectively preventing electrostatic discharge damage to a mounted electronic component by efficiently eliminating charged static electricity. <P>SOLUTION: A suspension substrate 1 with a circuit is provided with a metal supporting substrate 2; a base insulation layer 3 formed on the metal supporting substrate 2; a conductor pattern 4 formed on the base insulation layer 3; and a cover insulation layer 5 formed on the base insulation layer 3 so as to coat the conductor pattern 4. In this substrate 1, a semiconductive layer 7 containing conductive particles is formed on the cover insulation layer 5 other than a terminal portion 6, and plasma processing is applied to the surface of the semiconductor layer 7. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
