| 摘要 |
PROBLEM TO BE SOLVED: To provide a device of manufacturing a semiconductor device capable of manufacturing a semiconductor device with high quality at comparatively low costs by eliminating thermal expansion of a ball screw. SOLUTION: This manufacturing device cuts a workpiece along a block using a blade, and manufactures a semiconductor device. The manufacturing device has a ball screw which is a shaft of movement of the blade, and a cooling mechanism for emitting air to the ball screw and cooling the ball screw. COPYRIGHT: (C)2007,JPO&INPIT
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