| 摘要 |
An electronic component or assembly that is assembled within a case that is designed to operate as a liquid phase to gas phase heat pipe where said electronic component or assembly is introduced into a liquid or partially liquid partially gaseous environment; whereby said liquid evaporates into a gas absorbing heat energy and transferring it to and through the component's or assembly's case. The case will be engineered out of materials that do not contaminate the liquid and electronics with ions and will be engineered to operate in any physical orientation.
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