<p>A projection section having two mirrors at the leading end is sent from a side opening of a head, which is constituted by attaching a transparent sucking section to a lower opening of a reversely rotated frame having a recessed shape. A bump electrode functioning as an alignment mark formed on the surface of a chip component sucked and held by the sucking section, and the alignment mark on the surface of the substrate are reflected on the both mirrors provided on the projecting section. The both alignment marks are projected to a CCD camera arranged on the side, being separated from the head.</p>
