ANISOTROPIC-ELECTROCONDUCTIVE ADHESIVE, CIRCUIT CONNECTION USING THE SAME, AND CIRCUIT CONNECTION STRUCTURE

摘要

Provided is an anisotropic conductive adhesive, which allows circuit connection at low temperature in a short time, prevents a short circuit even under agglomeration of conductive particles, and is useful for the fabrication of a circuit connection structure. The anisotropic conductive adhesive(130) comprises: an insulating adhesive(140) comprising a radical polymerizable compound and a polymerization initiator and having a heat emission peak temperature of 80-120 deg.C; and a plurality of insulation material-coated conductive particles(150), comprising conductive particles(151) formed of a polymer nucleating agent whose surface is coated with a thin metal layer and a coating layer(152) formed on the surface of the conductive particles, the coating layer being formed of an insulating thermoplastic resin and having a thickness of 0.01-10 micrometers. The radical polymerizable compound is at least one compound selected from acrylate compounds and methacrylate compounds. The polymerization initiator is selected from peroxide compounds and azo-based compounds.