| 摘要 |
A cleaning agent for substrates and a cleaning method are disclosed which enable to effectively remove fine particles and impurities (metal impurities) derived from various metals on a substrate surface without roughening the substrate surface, especially the surface of a semiconductor substrate or causing corrosion or oxidation of metal wiring, especially of copper wiring formed on the substrate surface. The cleaning agent and cleaning method further enable to remove carbon defects on the substrate surface at the same time without removing a metal corrosion inhibitor-Cu coating film, especially a Cu-BTA coating film. The cleaning agent for substrates contains [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent and [III] an organic solvent selected from the group consisting of (1) monovalent alcohols, (2) alkoxy alcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles. The method for cleaning a substrate surface is characterized by processing the substrate surface with such a cleaning agent. |
