发明名称 |
DOUBLE STRUCTURE OF CHASSIS WITH WHICH PDP IS CLOSELY ATTACHED |
摘要 |
A dual chassis structure for enhancing a coupling state between a PDP and a chassis is provided to reduce effectively non-uniformity of temperature on an entire surface of the PDP by reducing heat resistance on a contact area between a dual chassis and a heat conducting sheet. A dual chassis structure for enhancing a coupling state between a PDP(160) and a chassis includes a first chassis(100) and a second chassis(100'). The PDP is attached through a heat conducting sheet(120) onto a surface of a first chassis having roughness. A drive circuit board is coupled with a surface of a second chassis having roughness. The drive circuit board is connected with the PDP and a flexible printed cable. The first chassis or the second chassis has surface roughness of 200 micrometers to 800 micrometers.
|
申请公布号 |
KR20060125227(A) |
申请公布日期 |
2006.12.06 |
申请号 |
KR20050047160 |
申请日期 |
2005.06.02 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
KIM, KI JUNG;KIM, MYOUNG KON |
分类号 |
H01J11/34 |
主分类号 |
H01J11/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|