发明名称 DOUBLE STRUCTURE OF CHASSIS WITH WHICH PDP IS CLOSELY ATTACHED
摘要 A dual chassis structure for enhancing a coupling state between a PDP and a chassis is provided to reduce effectively non-uniformity of temperature on an entire surface of the PDP by reducing heat resistance on a contact area between a dual chassis and a heat conducting sheet. A dual chassis structure for enhancing a coupling state between a PDP(160) and a chassis includes a first chassis(100) and a second chassis(100'). The PDP is attached through a heat conducting sheet(120) onto a surface of a first chassis having roughness. A drive circuit board is coupled with a surface of a second chassis having roughness. The drive circuit board is connected with the PDP and a flexible printed cable. The first chassis or the second chassis has surface roughness of 200 micrometers to 800 micrometers.
申请公布号 KR20060125227(A) 申请公布日期 2006.12.06
申请号 KR20050047160 申请日期 2005.06.02
申请人 SAMSUNG SDI CO., LTD. 发明人 KIM, KI JUNG;KIM, MYOUNG KON
分类号 H01J11/34 主分类号 H01J11/34
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