| 摘要 |
Semiconductor etching equipment having a suitable structure for fixing depo-shield in a process chamber is provided to stabilize surroundings of an etch process by uniformly etching the front surface of a semiconductor substrate in the process chamber during an etch process. A deposhield(20) and a deposhield protection unit(30) are installed in a process chamber. The deposhield protection unit has outer and inner surfaces which respectively come in contact with external and internal circumferential circles. At least one protrusion part(38) is formed on the inner surface of the deposhield protection unit. A receiving part(29) is extended toward by a predetermined depth from the surface of the deposhield confronting the inner surface of the deposhield protection unit. The receiving part of the deposhield has a hole shape, surrounding the protrusion part of the deposhield protection unit. The deposhield is located on the inner surface of the deposhield protection unit, surrounded by a sidewall having a right angle with respect to the outer surface of the deposhield protection unit. The protrusion part of the deposhield protection unit includes Al or W.
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