发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN WITH THE COMPOSITION |
摘要 |
A photosensitive resin composition comprises a multi-functional epoxy resin and a cation polymerization initiator represented by general formula (1) shown below:
(in the formura (1), X 1 and X 2 indicate a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond, and they may be identical to or different from one another. Y indicates a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond). The photosensitive resin composition is used as a pattern formation composition.
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申请公布号 |
EP1729175(A1) |
申请公布日期 |
2006.12.06 |
申请号 |
EP20040807118 |
申请日期 |
2004.12.15 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
MAEDA, HIROKI;TAKAHASHI, TORU;KATSUMATA, NAOYA |
分类号 |
G03F7/038;B41J2/16;C08G59/68;G03F7/004;G03F7/029 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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