发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN WITH THE COMPOSITION
摘要 A photosensitive resin composition comprises a multi-functional epoxy resin and a cation polymerization initiator represented by general formula (1) shown below: (in the formura (1), X 1 and X 2 indicate a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond, and they may be identical to or different from one another. Y indicates a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond). The photosensitive resin composition is used as a pattern formation composition.
申请公布号 EP1729175(A1) 申请公布日期 2006.12.06
申请号 EP20040807118 申请日期 2004.12.15
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 MAEDA, HIROKI;TAKAHASHI, TORU;KATSUMATA, NAOYA
分类号 G03F7/038;B41J2/16;C08G59/68;G03F7/004;G03F7/029 主分类号 G03F7/038
代理机构 代理人
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