| 摘要 |
A heat dissipation structure of an integrated circuit chip of a plasma display module and a plasma display module comprising the same are provided to dissipate effectively the heat from the integrated circuit chip by installing a heat-sink at a chassis bending part or an edge of a chassis base. A chassis(120) includes a chassis bending part(122) and a chassis base(121). A heat-sink(160) is mounted on the chassis bending part. An integrated circuit chip(150) is installed on the heat-sink and is connected with a signal transferring unit(140). The chassis bending part is formed at an edge of the chassis. The chassis includes aluminum and a synthetic resin. The heat-sink is formed by using a compressing method. The heat-sink includes a plurality of heat radiating fins.
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