发明名称 |
IMAGE SENSOR, AND METHOD FOR FABRICATING THE SAME |
摘要 |
An image sensor and a method for fabricating the same are provided to secure a p-type impurity region having a uniform doping level by forming a second epitaxial layer with silicon doped in an in-situ state or a SiGe epitaxial layer. A trench is formed at a predetermined region of a first conductive type semiconductor substrate(301). A second conductive type impurity region(308) for photodiode is formed within the first conductive type semiconductor substrate corresponding to a bottom surface of the trench. A second conductive type epitaxial layer(311) for photodiode is buried into the trench. A second epitaxial layer(312) is formed on the second conductive type epitaxial layer. A first conductive type impurity is doped on the second epitaxial layer by an in-situ method.
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申请公布号 |
KR100657143(B1) |
申请公布日期 |
2006.12.06 |
申请号 |
KR20050062301 |
申请日期 |
2005.07.11 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
CHA, HAN SEOB |
分类号 |
H01L27/146;H01L31/10;H04N5/335;H04N5/369;H04N5/372;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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