发明名称 IMAGE SENSOR, AND METHOD FOR FABRICATING THE SAME
摘要 An image sensor and a method for fabricating the same are provided to secure a p-type impurity region having a uniform doping level by forming a second epitaxial layer with silicon doped in an in-situ state or a SiGe epitaxial layer. A trench is formed at a predetermined region of a first conductive type semiconductor substrate(301). A second conductive type impurity region(308) for photodiode is formed within the first conductive type semiconductor substrate corresponding to a bottom surface of the trench. A second conductive type epitaxial layer(311) for photodiode is buried into the trench. A second epitaxial layer(312) is formed on the second conductive type epitaxial layer. A first conductive type impurity is doped on the second epitaxial layer by an in-situ method.
申请公布号 KR100657143(B1) 申请公布日期 2006.12.06
申请号 KR20050062301 申请日期 2005.07.11
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 CHA, HAN SEOB
分类号 H01L27/146;H01L31/10;H04N5/335;H04N5/369;H04N5/372;H04N5/374 主分类号 H01L27/146
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