| 摘要 |
<p>Described is a process for the fabrication of a semiconductor device, which comprises a step of simultaneously or successively mounting at least one semiconductor element having a connecting electrode portion onto each of both sides of an interconnection circuit substrate through an encapsulating resin layer and a step of connecting said at least one semiconductor element with an interconnection electrode on each of both sides of said interconnection circuit substrate by making use of the adhesive force of said encapsulating resin layer.</p> |
