发明名称 Method for manufacturing a circuit board and a system of circuit boards as well as a circuit board and a system of circuit boards made by the methods
摘要 The method involves forming a groove-shaped opening (4) with lateral projections (7) in a printed circuit board in an area of contacting surfaces (11-14) for receiving a terminal strip of another printed circuit board. An inner side of the opening is coated with a conductive layer, so that an electrical connection is made with the surfaces. The opening is broadened, such that the layer is received in the projections. An independent claim is also included for a printed circuit board system comprising printed circuit boards.
申请公布号 EP1729555(A1) 申请公布日期 2006.12.06
申请号 EP20050011726 申请日期 2005.05.31
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 FISCHER, ALFRED;GUBISCH, THOMAS;NIEBLER, GUENTHER;TEICHRIEB, EUGEN
分类号 H05K3/36;H05K1/14 主分类号 H05K3/36
代理机构 代理人
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