| 摘要 |
An electronic device includes a substrate (23) on which foot patterns (24A,24B) and a solder resist (25) are provided such that the foot patterns (24A,24B) are exposed from opening portions (27A,27B) in the solder resist (25), packaging parts (20A,20B) mounted on the substrate (23) by solder (26), and a sealing resin (29) formed on the substrate (23) to seal the packaging parts (20A,20B), wherein a part (running-on portions 26A,26B) of the solder (26) is constructed to run on an upper surface of the solder resist (25) under the packaging parts (20A,20B). |
