SURFACE-MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A surface mounted semiconductor device and a manufacturing method thereof are provided to improve a degree of freedom of a semiconductor device design and device property by encapsulating an electrode pad only. A supporting substrate(11) has a first and a second surface facing each other. A slit is formed on a center of the supporting substrate. The supporting substrate has a ball land, and a connecting terminal and a wire circuit on the second surface thereof. An electrode pad is formed on at least center of a semiconductor device(16). The electrode is located in the slit. A width of the semiconductor device is shorter than a longitudinal length of the slit. A metal fine line(18) electrically connects the electrode pad to the connecting terminal on the second surface. A first sealing resin member(20) is installed on the first surface to seal the semiconductor device. A second sealing resin member(21) is installed on the second surface to seal the slit.