| 发明名称 |
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced |
| 摘要 |
A method of producing a crystalline substrate based device includes forming a microstructure on a crystalline substrate. At least one packaging layer is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer.
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| 申请公布号 |
US7144745(B2) |
申请公布日期 |
2006.12.05 |
| 申请号 |
US20010922770 |
申请日期 |
2001.08.07 |
| 申请人 |
TESSERA TECHNOLOGIES HUNGARY KFT. |
发明人 |
BADEHI AVNER PIERRE |
| 分类号 |
H01L21/00;H01L23/02;B81B7/00;H01L21/44;H01L21/50;H01L23/10;H01L27/146;H03H3/02;H03H9/10 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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