| 摘要 |
A method for forming a direct chip attach device ( 1 ) includes attaching an electronic chip ( 3 ) to a lead frame structure ( 2 ), which includes a flag ( 18 ). Next, conductive studs ( 22 ) are attached to bond pads ( 13 ) on electronic chip ( 3 ) and flag ( 18 ) to form a sub-assembly ( 24 ). Sub-assembly ( 24 ) is then placed in a molding apparatus ( 27,47 ), which includes a first plate ( 29,49 ) and second plate ( 31,51 ). Second plate ( 31,51 ) includes a cavity ( 32,52 ) for receiving electronic chip ( 3 ) and flag ( 18 ), and pins ( 36,56 ). During a molding step, pins ( 36,56 ) contact conductive studs ( 22 ) to prevent encapsulating material ( 4 ) from covering studs ( 22 ). This forms openings ( 6 ) to receive solder balls ( 9 ) during a subsequent processing step.
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