| 摘要 |
An electronic device package is provided to perform a batch process of a wafer unit, by forming a dicing groove in a base substrate having a plurality of electronic devices, by bonding the base substrate to a cover substrate having a dicing groove and by separating the bonded substrates into individual packages by mechanical force. An electronic device is formed on a base substrate. An electrode line is withdrawn to a lateral surface of the electronic device, electrically connected to the electronic device. A groove is formed in the lower part of a cover substrate, and an electronic device is positioned in the groove. The cover substrate is bonded to the base substrate, exposing a part of the electrode line. The base substrate can be a semiconductor substrate, and the electronic device can be a device integrated in the semiconductor substrate.
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