| 摘要 |
A wafer cleaning apparatus is provided to enable cleaning of the front surface of a wafer by making the brush of the wafer cleaning apparatus have a circular pad type. A circular pad-type brush(130) comes in contact with a wafer to be cleaned. A plurality of injection holes for injecting a cleaning solution are formed in a part of the circular pad-type brush in contact with the wafer. The wafer is rotated by a roller. The brush is rotated by a driving part(150). At least two brushes can be installed at both sides of the wafer, parallel with each other and coming in contact with the upper and the lower surfaces of the wafer.
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