| 摘要 |
A light emitting diode package is provided to form a resin molding part having a tilted distribution of refractivity which is gradually lowered in a light extraction direction, by adding a transparent material particle to liquid transparent resin such that the transparent material particle has higher refractivity and density than that of a transparent resin material. A package substrate is provided which has a leadframe(23a,23b). A light emitting diode is mounted on the package substrate to be electrically connected to the leadframe. A molding part has a refractivity gradient in which an average refractivity of an upper region is gradually lowered in a lower region by a particle distribution of a transparent material having higher density and refractivity than those of at least transparent resin, made of the transparent resin to seal the light emitting diode. The molding part includes fluorescent powder(P), and the transparent material has a higher density than that of the fluorescent powder.
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