| 摘要 |
Elastomer bonding of a large area sputtering target is provided to reduce a bonding cost by improving a process for bonding the sputtering target on a backing plate. Elastomer bonding of a large area sputtering target includes a method of bonding at least one sputtering target tile to a backing plate(810). The bonding method includes a process for providing an elastomeric adhesive layer between sputtering target tiles(830C,830E) and the backing plate, and a process for providing at least one metal mesh within the elastomeric adhesive layer. One or more parts of the metal mesh contact both of the sputtering target tile and the backing plate. One or more parts of the metal mesh are formed with metal wires having a diameter more than 0.5 mm.
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