发明名称 |
Molding apparatus with a molding flowability sensor for packaging semiconductor device |
摘要 |
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
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申请公布号 |
US7144239(B2) |
申请公布日期 |
2006.12.05 |
申请号 |
US20040901039 |
申请日期 |
2004.07.29 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
WANG WEI-CHIH;LO KUANG-LIN;CHANG YUN-LUNG |
分类号 |
B29C45/77;B29C45/14;B29C45/76 |
主分类号 |
B29C45/77 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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