| 摘要 |
An LED package is provided to improve reliability and light emitting intensity by forming an LED package with a thickness of 0.5 mm or lower and by guaranteeing a design margin of a mobile telecommunication terminal. A first lead(23) is formed of a thin film. A second lead(25) is made of a thin film, located in a position confronting the first lead. An insulation layer(29) is formed between the first and the second leads. A light emitting device(21) is connected to the first and the second leads. The first lead, the second lead and the insulation layer constitute a leadframe in which a light emitting groove(27) is formed on one surface of the leadframe. The light emitting device is positioned in the leadframe. The light emitting device can be positioned on the first or the second lead. At least one of the first and the second leads is formed of a plurality of thin films. |
