| 摘要 |
<p>A wiring board, a semiconductor device, and a display module are provided to suppress occurrence of disconnection of wirings by relieving bending stress applied to conductive wirings. A plurality of conductive wirings(2) are arranged on a flexible insulating base(1). A projecting electrode(3) is installed at one end of the same side of each of the conductive wirings. An external terminal(4,5) is installed at the other end of each of the conductive wirings. A metal plating layer is formed on the conductive wirings, the projecting electrodes, and the external terminals. A solder resist layer(7) is formed by coating the conductive wirings in a region between an installation end of the protruding electrode and the external terminal. In a solder resist region, the metal plating layer is not formed on the conductive wirings. In addition, surfaces of the conductive wirings to be contacted with the flexible insulating base have surface roughness greater than surface roughness of surfaces not to be contacted with the flexible insulating base.</p> |
