发明名称 THE METHOD FOR MANUFACTURING THE MULTI-LAYERED COPPER-ELECTROFORMED PRODUCT
摘要 A method for manufacturing a multilayered copper-electroformed product that is harmless to the human body while showing a sufficient hardness value and manufacturing a multilayered copper-electroformed product capable of increasing reproducibility greatly when applying a hologram to the surface of the product is provided. A method for manufacturing a multilayered copper-electroformed product comprises the steps of: obtaining a reversed negative second master by plating a first master; plating imitation white gold on the reversed negative second master; plating a cobalt base on the imitation white gold plating layer; plating copper pyrophosphate on the cobalt base plating layer; and separating the new plating layer from the reversed negative second master. The method further comprises: a step of plating chromium on the imitation white gold plating layer after separating the new plating layer; and a forming step performed before the chromium plating step. The method further comprises the step of installing a hologram on the surface of the first master to form a hologram on a negative surface of the second master and the surface of the new plating layer.
申请公布号 KR20060124421(A) 申请公布日期 2006.12.05
申请号 KR20050046345 申请日期 2005.05.31
申请人 JU, DONG GEUN;CHO, MAN SHIK 发明人 JU, DONG GEUN;CHO, MAN SHIK
分类号 C25D5/10 主分类号 C25D5/10
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