| 摘要 |
A circuit carrier and a package structure thereof are provided. The circuit carrier comprises a substrate having a surface, a plurality of passive component electrode pads or a plurality of passive component electrode planes on the surface of the substrate for electrically connecting a passive component corresponding to the plurality of passive component electrode pads, and a solder mask layer covering the surface of the substrate and including at least a solder mask opening, that entirely exposing the passive component electrode pads or a portion of the surface of each the passive component electrode plane corresponding to the passive component. Because there is no solder mask layer between the bottom of the passive component and the substrate, the gap between the passive component and the substrate will become wider. Hence, remaining flux can be entirely removed in order to increase the yield rate of the subsequent high temperature process.
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