| 摘要 |
A radiation shielded module ( 120, 500, 600, 700 ) and method of shielding microelectronic devices ( 126, 412, 618 , and 718 ) including a single interconnect substrate ( 110, 400, 612, 712 ) having a first side ( 122, 410, 620, 720 ) and a second side ( 124, 416, 610, 710 ). At least one microelectronic device is coupled to the first side of the single interconnect substrate. A shielding structure ( 100, 200, 300, 614, 714 ) is coupled to the single interconnect substrate and configured to shield radio frequency interference (RFI) and electromagnetic interference (EMI) that propagate through at least a portion of the single interconnect substrate. |
