LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

An LED package is provided to reduce optical loss and to emit light in one direction by reversely reflecting the light emitted from an LED device through a reflection surface of a curved surface type. A groove part is formed in the upper surface of a metal substrate(101) and a reflection surface(101a) of a concavely curved type is formed on the bottom of the groove part. A plurality of leadframes(104,106) have leads(104b,106b) withdrawn to the upper part of the groove part, installed on the metal substrate. At least one LED device(50) is mounted on the lower surface of the lead to confront the reflection surface. A molding part is formed in the groove part to package the LED device. The leadframe is extended to the lower surface of the metal substrate along the outer circumferential surface of the metal substrate.