Flat substrate for electronic components, used as lead frame, includes contact parts with reduced width regions separated from component support surfaces by spaces

摘要

The substrate (1) contains spaces which divide it up into component support surfaces (2) with two adjoining contact parts (3) each separated from the surface by a space. One of the contact parts has a reduced width at a given greater distance from the support surface compared with a point at a shorter distance from this surface. An independent claim is also included for a method for detaching a support surface with an at least partly encapsulated electronic component (4) and adjoining contact parts from this substrate by punching from either side of the substrate in order to cut through the relatively thin regions of the contact parts.